specifications︰ Surface Particle, Surface Scan Particle. Pentagon Technologies for submicron and deep submicron (0.18, 0.13..) 's Production machine, for PM procedure can lower 50% Test Wafer's cost OEF(Overall Equipment Effectiveness), Thin Film( PVD, CVD..), Etching and Diffusion Equipments. ; MetOne Particle Counter to Mini-environment measure particle, TRH, DP, velocity..can support momitor Module equipment, process engineer/managercontamination issue.

Pentagon Technologies for Fab contamination cam offer(TSMC, UMC,ADM fab 25…) OFE (Overall Fab Effectiveness), QA advanced's help。

Advantages︰ Capture filter get particles . from EDX or FTIR particle 。
: PVD, CVD, Photo, Ion Plant, YE, QA, QC , Microntation , Etch, Diffusion..

IEST-CC-1246D, ISO14644-9 Surface Cleanliness
QIII+ , QIII ultra, QIII max, QIII LS,
QIII ST, QIII SM, QIII SX,

Export Markets︰ parts clean,SPD,car

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