specifications︰ | Surface Particle, Surface Scan Particle. Pentagon Technologies for submicron and deep submicron (0.18, 0.13..) 's Production machine, for PM procedure can lower 50% Test Wafer's cost OEF(Overall Equipment Effectiveness), Thin Film( PVD, CVD..), Etching and Diffusion Equipments. ; MetOne Particle Counter to Mini-environment measure particle, TRH, DP, velocity..can support momitor Module equipment, process engineer/managercontamination issue.
Pentagon Technologies for Fab contamination cam offer(TSMC, UMC,ADM fab 25…) OFE (Overall Fab Effectiveness), QA advanced's help。 |
Advantages︰ | Capture filter get particles . from EDX or FTIR particle 。 : PVD, CVD, Photo, Ion Plant, YE, QA, QC , Microntation , Etch, Diffusion..
IEST-CC-1246D, ISO14644-9 Surface Cleanliness QIII+ , QIII ultra, QIII max, QIII LS, QIII ST, QIII SM, QIII SX, |
Export Markets︰ | parts clean,SPD,car |
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